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Specialty DRAMSRAMKGDM

  • Enduring SDRAM
  • Wide-Bandwidth DDR DRAM
  • Low Power DRAM
  • Handheld Low Power DRAM
Density Organization Part No. Speed(ns) VDD,Interface Package Notes Data Sheet
256Mb 16Mx16 EM63A165TS 6, 7 3.3V, LVTTL 54-pin TSOPII, Pb and Halogen Free N/A
128Mb 8Mx16 EM639165TS/VM 6, 7 3.3V, LVTTL 54-pin TSOPII, Pb and Halogen Free
54-Ball TFBGA, Pb Free
N/A
128Mb 8Mx16 EM639165TS/VM-XXI 6, 7 3.3V, LVTTL Industrial Grade
54-pin TSOPII, Pb and Halogen Free
54-Ball TFBGA, Pb Free
N/A
128Mb 4Mx32 EM669325BK 6 3.3V, LVTTL 90-ball FBGA, Pb Free N/A
128Mb 4Mx32 EM639325TS 6 3.3V, LVTTL 86-pin TSOPII, Pb and Halogen Free N/A
64Mb 4Mx16 EM638165TS/VE 5, 6, 7 3.3V, LVTTL 54-pin TSOPII, Pb and Halogen Free,
60-Ball VFBGA, Pb Free
N/A
64Mb 4Mx16 EM638165TS/VE-XXI 6, 7 3.3V, LVTTL Industrial Grade
54-pin TSOPII, Pb and Halogen Free
60-Ball VFBGA, Pb Free,
N/A
64Mb 2Mx32 EM638325TS/BG 5, 5.5, 6, 7 3.3V, LVTTL 86-pin TSOPII, Pb and Halogen Free
90-Ball LFBGA, Pb Free
N/A
16Mb 1Mx16 EM636165TS/VE 5, 5.5, 6, 7 3.3V, LVTTL 50-pin TSOPII, Pb and Halogen Free
60-Ball VFBGA, Pb Free
N/A
16Mb 1Mx16 EM6A6165TS 7, 10 2.5, LVCMOS 50-pin TSOPII, Leaded and Lead Free N/A
Density
Organization Data Sheet
Part Number
Speed(ns) VDD,Interface Package Notes
256Mb 8Mx32 EM6AA320BI 5 2.5V, SSTL_2 Stacked CSP,
144-ball FBGA, Pb Free
 
256Mb 16Mx16 EM6AA160TS 4, 5 2.5V, SSTL_2 66-pin TSOPII, Pb Free  
128Mb 4Mx32 EM6A9320BI 5 2.5V, SSTL_2 144-ball FBGA, Pb Free  
128Mb 8Mx16 EM6A9160TS 4, 5 2.5V, SSTL_2 66-pin TSOPII, Pb Free  
Density
Organization Data Sheet
Part Number
Speed(ns) VDD,Interface Package Notes
128Mb 8Mx16 EM639165TS-XXLG 6, 7 3.3V, 800uA, LVTTL 54 Pin TSOPII, Lead Free  
16Mb 1Mx16 EM636165TS/VE-XXLG 7 3.3V, 600uA, LVTTL 50 Pin TSOPII, Lead free
60 Ball VFBGA, Lead free
 
Density
Organization Data Sheet
Part Number
Speed(ns) VDD,Interface Package Notes
No Data
  • Ultra Low Power SRAM
  • Very Low Power Pseudo SRAM
Density
Organization Data Sheet
Part Number
Speed(ns) VDD,
Interface
Package Notes
8M
512Kx16
EM565161BA/BJ
55, 70 3.0 ~ 3.6V, 35uA, 2-CS 48 Ball TFBGA, Lead and Lead free
(BA:8x10mm, BJ:6x9mm)
 
4Mb
256Kx16
EM564161BC
55, 70, 85 3.0~ 3.6V, 35uA, 2-CS 48 Ball FBGA
(BC:6x8mm)
 
4Mb
256Kx16
EM564166TS/BC
55, 70, 85 2.7 ~ 3.6V, 35uA, 1-CS 44L TSOPII, Lead free,
48 Ball FBGA (BC:BC:6x8mm), Lead free
 
2Mb
128Kx16
EM562161BC
55, 70 2.7 ~ 3.6V, 35uA, 2-CS 48 Ball TFBGA (BC:6x8mm)  
2Mb
128Kx16
EM562166TS/BC
55, 70 2.7 ~ 3.6V, 35uA, 1-CS 44 Pin TSOPII, Leaded
48 Ball TFBGA (BC:6x8mm), Leaded and Leaded free
 
Density
Organization Data Sheet
Part Number
Speed(ns) VDD,
Interface
Package Notes
No Data

Superior Quality and Reliability

The emerging demand for system-in-a-package (SIP) and multi-chip package (MCP) chips has called for Known Good Die solutions with the highest quality. With years of experience in KGDM technology developments, Etron has been a key partner and supplier for many leading semiconductor and system customers worldwide. With a proven track record of high volume manufacturing(HVM) capability, top quality products, and strong commitment to customer satisfaction, Etron has set itself apart from competitors.

  • Novel Circuit Design
  • High Quality and Reliability
  • Stringent Wafer-Level-Burn-In Testing
  • Optimum Balance between Cost-Effectiveness and Reliability
  • Small Form Factor
  • High Integration
  • Tailored Services

KGDM Products

  • SDRAM: 16Mb, 64Mb, 128Mb
  • LPSDRAM: 16Mb, 64Mb, 128Mb
  • DDR SDRAM: 64Mb, 128Mb, 256Mb
  • PSRAM: 8Mb, 16Mb, 32Mb
  • LPSRAM: 2Mb, 4Mb and 8Mb

Applications

  • Digital TV
  • Projector
  • Digital Camera
  • DSC Module
  • Hard Disk Drive
  • Micro Drive
  • Wireless Chipset
  • DSL Chipset
  • PDA
  • Cellular Phone
  • MP3 Player
  • Portable DVD Player
  • Others