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|Specialty DRAM |SRAM |KGDM |
Enduring SDRAM
Wide-Bandwidth DDR DRAM
Low Power DRAM
Handheld Low Power DRAM
Density
Organization
Part No.
Speed(ns)
VDD,Interface
Package
Notes
Data Sheet
256Mb
16Mx16
EM63A165TS
6, 7
3.3V, LVTTL
54-pin TSOPII, Pb and Halogen Free
N/A
128Mb
8Mx16
EM639165TS/VM
6, 7
3.3V, LVTTL
54-pin TSOPII, Pb and Halogen Free
54-Ball TFBGA, Pb Free
N/A
128Mb
8Mx16
EM639165TS/VM-XXI
6, 7
3.3V, LVTTL
Industrial Grade
54-pin TSOPII, Pb and Halogen Free
54-Ball TFBGA, Pb Free
N/A
128Mb
4Mx32
EM669325BK
6
3.3V, LVTTL
90-ball FBGA, Pb Free
N/A
128Mb
4Mx32
EM639325TS
6
3.3V, LVTTL
86-pin TSOPII, Pb and Halogen Free
N/A
64Mb
4Mx16
EM638165TS/VE
5, 6, 7
3.3V, LVTTL
54-pin TSOPII, Pb and Halogen Free,
60-Ball VFBGA, Pb Free
N/A
64Mb
4Mx16
EM638165TS/VE-XXI
6, 7
3.3V, LVTTL
Industrial Grade
54-pin TSOPII, Pb and Halogen Free
60-Ball VFBGA, Pb Free,
N/A
64Mb
2Mx32
EM638325TS/BG
5, 5.5, 6, 7
3.3V, LVTTL
86-pin TSOPII, Pb and Halogen Free
90-Ball LFBGA, Pb Free
N/A
16Mb
1Mx16
EM636165TS/VE
5, 5.5, 6, 7
3.3V, LVTTL
50-pin TSOPII, Pb and Halogen Free
60-Ball VFBGA, Pb Free
N/A
16Mb
1Mx16
EM6A6165TS
7, 10
2.5, LVCMOS
50-pin TSOPII, Leaded and Lead Free
N/A
Density
Organization
Data Sheet
Part Number
Speed(ns)
VDD,Interface
Package
Notes
256Mb
8Mx32
EM6AA320BI
5
2.5V, SSTL_2
Stacked CSP,
144-ball FBGA, Pb Free
256Mb
16Mx16
EM6AA160TS
4, 5
2.5V, SSTL_2
66-pin TSOPII, Pb Free
128Mb
4Mx32
EM6A9320BI
5
2.5V, SSTL_2
144-ball FBGA, Pb Free
128Mb
8Mx16
EM6A9160TS
4, 5
2.5V, SSTL_2
66-pin TSOPII, Pb Free
Density
Organization
Data Sheet
Part Number
Speed(ns)
VDD,Interface
Package
Notes
128Mb
8Mx16
EM639165TS-XXLG
6, 7
3.3V, 800uA, LVTTL
54 Pin TSOPII, Lead Free
16Mb
1Mx16
EM636165TS/VE-XXLG
7
3.3V, 600uA, LVTTL
50 Pin TSOPII, Lead free
60 Ball VFBGA, Lead free
Density
Organization
Data Sheet
Part Number
Speed(ns)
VDD,Interface
Package
Notes
No Data
Ultra Low Power SRAM
Very Low Power Pseudo SRAM
Density
Organization
Data Sheet
Part Number
Speed(ns)
VDD,
Interface
Package
Notes
8M
512Kx16
EM565161BA/BJ
55, 70
3.0 ~ 3.6V, 35uA, 2-CS
48 Ball TFBGA, Lead and Lead free
(BA:8x10mm, BJ:6x9mm)
4Mb
256Kx16
EM564161BC
55, 70, 85
3.0~ 3.6V, 35uA, 2-CS
48 Ball FBGA
(BC:6x8mm)
4Mb
256Kx16
EM564166TS/BC
55, 70, 85
2.7 ~ 3.6V, 35uA, 1-CS
44L TSOPII, Lead free,
48 Ball FBGA (BC:BC:6x8mm), Lead free
2Mb
128Kx16
EM562161BC
55, 70
2.7 ~ 3.6V, 35uA, 2-CS
48 Ball TFBGA (BC:6x8mm)
2Mb
128Kx16
EM562166TS/BC
55, 70
2.7 ~ 3.6V, 35uA, 1-CS
44 Pin TSOPII, Leaded
48 Ball TFBGA (BC:6x8mm), Leaded and Leaded free
Density
Organization
Data Sheet
Part Number
Speed(ns)
VDD,
Interface
Package
Notes
No Data
Superior Quality and Reliability
The emerging demand for system-in-a-package (SIP) and multi-chip package (MCP) chips has called for Known Good Die solutions with the highest quality. With years of experience in KGDM technology developments, Etron has been a key partner and supplier for many leading semiconductor and system customers worldwide. With a proven track record of high volume manufacturing(HVM) capability, top quality products, and strong commitment to customer satisfaction, Etron has set itself apart from competitors.
Novel Circuit Design
High Quality and Reliability
Stringent Wafer-Level-Burn-In Testing
Optimum Balance between Cost-Effectiveness and Reliability
Small Form Factor
High Integration
Tailored Services
KGDM Products
SDRAM: 16Mb, 64Mb, 128Mb
LPSDRAM: 16Mb, 64Mb, 128Mb
DDR SDRAM: 64Mb, 128Mb, 256Mb
PSRAM: 8Mb, 16Mb, 32Mb
LPSRAM: 2Mb, 4Mb and 8Mb
Applications
Digital TV
Projector
Digital Camera
DSC Module
Hard Disk Drive
Micro Drive
Wireless Chipset
DSL Chipset
PDA
Cellular Phone
MP3 Player
Portable DVD Player
Others